摘要
During the past decade,significant progress has been achieved in the application of material modeling to aid technology development in semiconductor manufacturing companies such as Intel.In this paper,we review examples of applications involving a complex set of material modeling tools and methodologies and share our perspective of the future of the area.Examples are given illustrating the landscape of useful physical models and approaches along with commentary addressing tool relevance and simulation efficiency issues.While the scope of this paper precludes providing in-depth details,references to more focused publications are shared.Finally,we outline how to approach constructing a general infrastructure for supporting TCAD material modeling applications.
