MEMS平面线圈电镀制备方法研究

Electroplating Fabrication of MEMS Planar Coil

通过提高微型线圈匝数不仅可以提高微型电磁能量采集器的俘能效率,还能够提高传感器的电学性能.本文基于微机电系统(MEMS)工艺,对电镀工艺中电镀液、电流密度、电流强度、温度等参数进行探索优化,在刚性基底上制备出高质量高密度的双层互连MEMS微型线圈.研究结果表明:该工艺大幅度提升了线圈匝数(最大匝数可达到800),且有效解决了狭小空间下MEMS电磁能量采集器的输出电压低、俘能效率低等问题.同时,该工艺在晶圆级硅基底上实现了微线圈的制备,展现出可控批量化加工优势.

Increasing the number of the micro-coils could not only improve the energy capture efficiency of the micro-electromagnetic energy harvester,but also improve the electrical performance of the sensor.Based on the micro-electromechanical system(MEMS)technology,the parameters of electroplate liquid,current density,current intensity and temperature were explored and optimized,and the high-density double-layer interconnected MEMS micro-coil was fabricated on the rigid Si wafer.The results show that this process greatly increases the number of the coils(the maximum number of turns can reach 800),and effectively solves the problems of low output voltage and low energy capture efficiency of electromagnetic energy harvesters in the confined spaces.Furthermore,the developed process realizes the fabrication of micro-coil on wafer-level silicon substrate,showing the advantage of the controlled batch processing.