烧结温度对Cu-P金属结合剂堆积磨料结构和性能的影响

Effect of Sintering Temperature on Microstructures and Properties of Agglomerated Grains Bonded with Cu-P Alloy Powder

在不同烧结温度下,以Cu-P合金为结合剂制备金刚石堆积磨料.利用差热分析(DTA)和X射线衍射(XRD)测试Cu-P合金的熔化特性与物相组成,采用扫描电镜(SEM)方法对堆积磨料的显微结构、金刚石和结合剂界面润湿性进行分析,并测试堆积磨料的单颗粒抗压强度、冲击韧性、气孔率、平均孔径尺寸等物理性能.对比了不同温度下烧结制备的堆积磨料的磨削性能,并阐述磨料磨损机理.结果表明,760℃烧结的堆积磨料,Cu-P结合剂对金刚石的包裹程度好,润湿性好,金刚石出刃高度适宜,并具有优异的力学性能.其单颗粒抗压强度、冲击韧性、气孔率、平均孔隙尺寸分别为23 N、78%、29.33%、18.53μm.760℃烧结的堆积磨料具有最优的磨削性能,磨削后砂轮中的堆积磨料处于半磨损状态,当氧化锆陶瓷的磨削比为24.8时,工件表面粗糙度为1.01μm.

Agglomerated grains of diamond bonded with Cu-P alloy powder are prepared at various sintered temperatures.Differential thermal analysis(DTA)and X-ray diffraction(XRD)are used to test the melting characteristics and phase composition of the Cu-P alloy.A scanning electron microscope(SEM)is used to analyze the microstructure of the agglomerated grains of diamond,the wettability of diamond and the bond interface.The physical properties such as single particle compressive strength,impact toughness(TI),porosity and average pore size of the agglomerated grains of diamond are tested.Meanwhile,the grinding performance of the agglomerated grains of diamond prepared at various sintering temperatures is compared,and their grinding mechanism is explained.The results indicate that for agglomerated grains of the diamond sintered at 760℃,the diamond is well wrapped by Cu-P bond with a good wettability and an appropriate protrusion height.The agglomerated grains of diamond have excellent mechanical properties.Its single particle compressive strength,impact toughness,porosity and average pore size are 23 N,78%,29.33%and 18.53μm,respectively.The agglomerated grains of the diamond sintered at 760℃show the best grinding performance.After grinding,the agglomerated grains of diamond in the grinding wheel are in a semi-wear state.Moreover,the grinding ratio to zirconia ceramics is 24.8,and the surface roughness is 1.01μm.