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接枝改性SBS介电弹性体的电致形变与损伤修复研究 被引量:2

Study on Electrodeformation and Damage Healing of Graft Modified SBS Dielectric Elastomer
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摘要 通过综合比较现有介电弹性体性能提升方法,选取巯基乙酸甲酯接枝改性苯乙烯–丁二烯–苯乙烯嵌段共聚物(styrene-butadiene-styrene,SBS),制备高电致形变且具有自修复功能的介电弹性体材料,利用红外光谱仪、核磁氢谱仪、万能拉力机、宽频介电谱仪、电致形变装置测试其性能。研究表明,该文制备的改性材料接枝率为94.7%,断裂伸长率为483%,满足柔性电子设备要求。SBS经过接枝改性后,弹性模量下降,介电常数提高,整体表现为电致形变性能显著提升。改性材料凭借修复界面处的CH/π键相互作用在室温条件下实现剪切损伤自修复,而CH/π键的数量会随时间及温度发生变化,并决定修复强度。该研究有助于推动低电压、大形变、长寿命介电弹性体材料的研发及应用。 In this paper, the methyl thioglycolate graft modification SBS scheme was used to prepare highly elastically deformable and self-healing dielectric elastomer material by comprehensively comparing the existing dielectric elastomer performance improvement methods. The performance was tested using infrared spectrometer, nuclear magnetic hydrogen spectrometer, universal tensile machine,broadband dielectric spectrometer, and electrodeformation device. The research shows that the graft ratio of the modified material prepared in this paper is 94.7% and the elongation at break of 483% meets the requirements of soft electronic devices. After graft modification of SBS, the elastic modulus decreases and the dielectric constant increases. Overall, the electro-deformation performance was significantly improved.Modified material achieves self-heal of shear damage by CH/π bond interaction at the healing interface, and the change in the number of CH/π bonds with time and temperature determines its healing strength. This research will help promote the development and application of low-voltage, large-deformation,long-life dielectric elastomer materials.
作者 张占喜 王有元 祝小松 李玉栋 张艳芳 ZHANG Zhanxi;WANG Youyuan;ZHU Xiaosong;LI Yudong;ZHANG Yanfang(State Key Laboratory of Power Transmission Equipment&System Security and New Technology(Chongqing University),Shapingba District,Chongqing 400030,China)
出处 《中国电机工程学报》 EI CSCD 北大核心 2021年第11期3951-3961,共11页 Proceedings of the CSEE
基金 国家自然科学基金项目(51777018) 中央高校基本科研业务费专项资金资助项目(2019CDXYDQ0010)。
关键词 介电弹性体 接枝改性 电致形变 自修复 CH/π键 dielectric elastomer graft modification electrodeformation self-healing CH/πbond
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