X波段MEMS环行隔离滤波芯片

X-Band MEMS Circulator-Isolator-Filter Chip

设计并制备了一种X波段微电子机械系统(MEMS)环行隔离滤波芯片,该芯片以高阻硅作为衬底材料,由2个MEMS环行器、1个薄膜匹配电阻以及1个MEMS滤波器四部分优化集成在一起,实现多功能芯片化。相比传统环行隔离器外接滤波器,其具有优良的电磁兼容及带外抑制能力,同时具有尺寸小、内部匹配好、易于调试装配等特点。基于MEMS环行器及MEMS滤波器的设计理论,结合三维电磁仿真软件,实现环行隔离滤波芯片的仿真设计。芯片整体尺寸为10 mm×10 mm×2.5 mm,频率为8.5~11.5 GHz,带内回波损耗>20 dB,收发通道的带外抑制>25 dB@7 GHz&13 GHz。

With high-resistance silicon as the substrate material, an X-band circulator-isolator-filter chip was designed and fabricated based on the micro-electromechanical system(MEMS) technology. The chip was optimally integrated by four parts, i.e. two MEMS circulators, a thin film matching resistor and a MEMS filter. The four components were designed on the same substrate to realize the multi-function chip. Compared with the external filter of the traditional circulatorisolator, the chip has advantages of excellent electromagnetic compatibility, out-of-band rejection, small size, better inner match,easy debugging and assembling, etc. Based on the design theories of the MEMS circulator and MEMS filter, the simulation and design of the circulator-isolator-filter chip was realized by the combination with 3D electromagnetic simulation software. The overall size of the chip is 10 mm×10 mm×2.5 mm,the frequency is 8.5-11.5 GHz, the in-band return loss is greater than 20 dB, and the out-of-band rejection of the transmitter-receiver channel is over 25 dB@7 GHz&13 GHz.