镀铜过程对焊丝铜层质量的影响

Influence of copper plating process on copper layer quality of welding wire

铜层质量是影响焊丝送丝性能关键因素之一,镀铜过程对焊丝铜层质量起决定性作用。焊丝镀铜普遍采用化镀法,镀铜过程中影响铜层质量主要因素包括镀液成分、质量浓度、温度、焊丝运行速度、镀槽有效长度等。镀液主要由硫酸铜、硫酸、添加剂、铁离子、水等组成。这几种因素对铜层质量包括厚度、结合力、致密性、防锈能力等的影响存在一种制约平衡关系,各因素应结合实际生产情况控制在一定范围内,有机结合才可确保良好的铜层。

The quality of copper layer is one of the key factors affecting wire feeding performance of welding wire.Copper plating process play a decisive role in copper layer quality of welding wire.Electroless copper plating is widely used for welding wire.The main factors affecting copper layer quality include plating solution composition,mass concentration,temperature,running speed of welding wire,effective length of plating bath,etc.Plating solution is mainly composed of copper sulfate,sulfuric acid,additive,iron ion and water.The influence of these factors on copper layer quality,including thickness,adhesion,compactness and antirust ability,has a kind of restriction balance relationship.All factors should be controlled in a certain range according to actual production situation,and organic combination can ensure good copper layer.