压接型IGBT器件封装退化监测方法综述

Review on Package Degradation Monitoring Methods of Press-Pack IGBT Modules

压接型IGBT器件是智能电网中大容量电力电子装备的基础核心器件,其可靠性直接关系到装备及电网的运行安全,而封装失效是其主要失效模式,封装退化监测是实现其故障诊断、状态预测及智能运维的关键。针对现有研究大多侧重于传统焊接型IGBT器件封装退化监测的问题,该文以压接型IGBT器件为研究对象,首先,介绍压接型IGBT器件封装结构;然后,系统分析微动磨损失效、栅氧化层失效、接触面微烧蚀失效、边界翘曲失效、弹簧失效、短路失效、开路失效共七种封装失效模式及对应的封装退化监测方法,并提出现有监测方法存在的问题;最后,从封装退化表征及评估、非接触式监测、高灵敏度监测三个方面,展望压接型IGBT器件封装退化监测新思路。

Press-pack IGBT modules are the basic core modules of large-capacity power electronic equipment in the smart grid.Therefore,their reliability is directly related to operation safety of equipment and power grid.Package failure is the main failure mode of press-pack IGBT modules,and package degradation monitoring is the key to achieve fault diagnosis,state prediction,and intelligent operation and maintenance.The existing research is focusing on the package degradation monitoring of traditional wire-bond IGBT modules.This paper took press-pack IGBT modules as the research object,and firstly introduced the packaging structure of press-pack IGBT modules.Then,seven kinds of package failure modes including fretting wear failure,gate-oxide failure,contact surfaces micro eroding failure,lids warping failure,short-circuit failure,open-circuit failure,and corresponding package degradation monitoring methods were systematically analyzed,and the problems of the existing monitoring methods were proposed.Finally,new ideas for package degradation monitoring of press-pack IGBT modules were proposed from the three aspects of packaging degradation characterization and evaluation,non-contact monitoring,and high-sensitivity monitoring.