3D封装的故障隔离与故障分析

Fault Isolation and Fault Analysis of 3D Package

3D封装是一种小尺寸、轻重量、低功耗、低成本的先进封装工艺,结合其在实际应用中通常出现的可靠性问题,从非破坏性与破坏性两方面对可用于3D封装故障隔离与故障分析的方法展开介绍。通过精确定位来暴露失效位置,使用开放性高阻故障隔离、短路故障隔离、无损及高分辨率成像技术等方法,来实现非破坏性故障隔离与分析;通过破坏性的制样和物理分析等方法来探寻失效原因。所提出的方法可为POP、芯片堆叠式等结构的3D封装工艺的改进和优化提供参考。

3D packaging is an advanced packaging technology with small size,light weight,low power consumption and low cost.Combined with its reliability problems in practical applications,the methods for fault isolation and fault analysis of 3D packaging are introduced from non-destructive and destructive aspects.The failure position is exposed by accurate positioning,and the non-destructive fault isolation and analysis are realized by using open high resistance fault isolation,short circuit fault isolation,lossless and high resolution imaging technology;Through destructive sample preparation and physical analysis,the failure causes are explored.The proposed methods can provide reference for the improvement and optimization of 3D packaging technology with POP and chip stacking structures.