单晶硅微铣削表面粗糙度实验研究

Experimental study on surface roughness of monocrystalline silicon by micro-milling

单晶硅是一种难加工材料,为优化单晶硅微铣削工艺参数,在水基切削液条件下,采用直径0.5 mm的金刚石涂层微铣刀,在单晶硅(100)晶面[100]晶向进行全槽铣削加工,基于正交实验研究每齿进给量、主轴转速和轴向切削深度对表面粗糙度的影响规律,分析单晶硅表面形貌,结合未变形切削厚度研究表面粗糙度变化规律。结果表明:表面粗糙度随着最大未变形切削厚度的增大而增大;影响表面粗糙度的主次因素依次为每齿进给量、主轴转速、轴向切深,在加工参数f_(z)=0.05~0.4μm/z,n=10000~30000 r/min,a_(p)=5~15μm时,获得的最优工艺参数为f_(z)=0.05μm/z,n=10000 r/min,a_(p)=5μm,此时单晶硅表面粗糙度为Ra=0.138μm。

Monocrystalline silicon is a kind of material that is difficult to process.In order to optimize the process parameters of monocrystalline silicon,a diamond coated micromilling cutter with a diameter of 0.5 mm was used for full slot milling in the[100]direction of monocrystalline silicon(100)crystal plane under the condition of water-based cutting fluid.Based the orthogonal test,the effects of feed per tooth,spindle speed and axial cutting depth on the surface roughness were studied,and the surface morphology of monocrystalline silicon was analyzed.Combined with undeformed cutting thickness,the change law of surface roughness was studied.The results show that the surface roughness increases with the increase of the maximum undeformed cutting thickness,and the primary and secondary factors affecting the surface roughness are the feed per tooth,spindle speed and axial cutting depth in turn.When the machining parameter is f_(z)=0.05~0.4μm/z,n=10000~30000 r/min,a_(p)=5~15μm,the optimal process parameter is f_(z)=0.1μm/z,n=10000 r/min,a_(p)=5μm,and the surface roughness of monocrystalline silicon is Ra=0.138μm.