发光二极管用封装材料的研究进展

Research progress of packaging materials for LED

介绍了LED封装材料的设计思路。叙述了近年来封装材料的研究现状,根据无机纳米粒子的引入与否将其分为本征型封装材料和纳米复合封装材料。封装材料作为LED器件重要的组成部分,除了起到保护和支撑作用,还需要具备高折射、高透明以及耐老化等性能。目前研究主要聚焦于封装材料的光学性能和热稳定性,而对加工、力学、粘接、流动性能等重要指标上鲜有报道。认为今后研究应对材料结构进行合理设计,平衡众多性能;有机硅材料具有高透光率、耐老化、耐高温、性能易调控等特点是未来封装材料的主流研究方向。

This article introduces the design ideas of LED packaging materials.The current research status of packaging materials in recent years is reviewed.According to whether inorganic nanoparticles are introduced or not,they are divided into intrinsic packaging materials and nanocomposite packaging materials.Packing materials were important part of LED for not only their protection and support,but their high refractive index,high transparency and weather resistance abilities.Finally,it is proposed that organic silicon materials have the characteristics of high light transmittance,aging resistance,high temperature resistance,and easy performance control,which are the mainstream research directions of future packaging materials.