CSP工艺封装智能卡模块技术研究

Research on smart card packaging technology ofchip scale package module

CSP工艺封装智能卡模块技术是用CSP封装工艺技术替代传统的智能卡模块封装金丝键合的封装工艺。该技术属于智能卡行业首创,在智能卡模块封装领域,不管是在国内还是国外,尚没有此工艺技术封装智能卡模块。该封装工艺和封装设备及相关测试设备均为自行研发,并全部实现国产化。CSP工艺封装智能卡模块技术跟原有传统智能卡卷带式模块封装技术的区别在于:传统智能卡模块是以进口载带正贴片,打金线键合、塑封料塑封的封装工艺,而CSP工艺封装智能卡模块技术是以FR-4树脂覆铜板,借助芯片二次布线、锡球植入技术,以芯片倒装和回流焊接为主,无需金线键合和塑封料塑封。简单地说,就是将原有的金线键合芯片封装形式改成SMT(Surface Mounted Technology)贴片封装形式实现芯片级封装的一种封装技术,简化了封测的工艺流程。CSP工艺封装智能卡模块技术增加了产品的可靠性,提升了生产效率和成品率。

CSP packaging technology of smart card module is to replace the traditional gold wire bonding packaging technology with CSP packaging technology.It is the first in the smart card industry.In the field of smart card module packaging,there is no such technology to package smart card module,whether at home or abroad.The packaging process,packaging equipment and related test equipment are self-developed,and all of them are localized.The packaging technology of CSP module smart card is different from the traditional packaging technology. The traditional packaging technology of CSP module smart card is imported tape positive placement, gold wire bonding and plastic packaging. The packaging technology of CSP module smart card is FR-4 resin copper clad laminate, with the help of chip secondary wiring and solder ball implantation technology, mainly with flip-chip assembly and reflow. Without gold wire bonding and plastic packaging, simply speaking, the original gold wire bonding chip packaging form is changed to Surface Mounted Technology chip packaging form, which is a kind of packaging technology to realize chip level packaging. It simplifies the packaging process, increases the reliability of the product, and improves the production efficiency and yield.