摘要
研究了在热载荷作用下的细晶粒压电涂层/基底界面裂纹的力学行为,利用积分变换方法把热力学问题转变成了求解奇异积分方程,得出了问题的温度场及热流强度因子。最后,通过数值算例给出了热流强度因子同裂纹尺寸和涂层厚度之间的关系。结果表明:在热载荷的作用下涂层厚度较小时容易造成裂纹的扩展,可以通过增加涂层厚度来增强结构的安全性。
The mechanical behavior of the interface crack of fine-grained piezoelectric coating/substrate under thermal loading is investigated.By using integral transformation method,the thermodynamic problem was transformed into solving singular integral equation,and the temperature field and heat flux intensity factor of the problem were obtained.Finally,the relationship between thermal intensity factor and crack size and coating thickness were given by numerical examples.The results show that when the coating thickness is small under the action of thermal load,it is easy to cause crack propagation,and the safety of the structure can be enhanced by increasing the coating thickness.
作者
胡帅帅
刘建生
李俊林
魏含玉
HU Shuai-shuai;LIU Jian-sheng;LI Jun-lin;WEI Han-yu(School of Materials Science and Engineering, Taiyuan University of Science and Technology, Taiyuan 030024, China;School of Mathematics and Statistics, Zhoukou Normal University, Zhoukou 466000, China;School of Applied Science, Taiyuan University of Science and Technology, Taiyuan 030024, China)
出处
《科学技术与工程》
北大核心
2021年第16期6582-6586,共5页
Science Technology and Engineering
基金
国家自然科学基金面上项目(11972019)
河南省自然科学基金(202300410524)
河南省科技攻关项目(212102310397)。
关键词
细晶粒压电涂层
界面裂纹
热载荷
热流强度因子
fine-grained piezoelectric coating
interface crack
thermal loading
thermal intensity factor
