多芯片用热管散热器的数值分析和实验研究

Numerical Simulation and Experiment Study on Heat Sink With Heat Pipe for Chips

根据芯片的高散热要求,设计了一种带有热管和不同翅片参数的散热器。采用数值模拟的方法分析了散热器翅片参数、热管数量和布局等参数对散热性能的影响,以确定最优设计方案,并对热管散热器的热性能进行了实验测试。测试结果表明,设计的热管散热器能满足使用要求,解决了芯片的散热问题。

A heat sink with heat pipe and different fins is designed to meet the higher thermal requirement used for cooling chips.The effect of the different zipper fin stack parameter,heat pipe number and layout on the thermal performance is analyzed with numerical simulation.The optimum solution is defined.Then the thermal performance of heat sink with heat pipe is tested.The test results show that the designed heat sink with heat pipe can meet the thermal requirement and solve the thermal problem of electric die.