大尺寸气密性陶瓷封装盖板可靠性数值模拟

Numerical Simulation of the Reliability of Large-size Hermetic Ceramic Package Lids

大尺寸气密性陶瓷封装器件在生产、运输和服役过程中不可避免地会受到各种载荷的影响,由于盖板尺寸过大,容易发生可靠性问题,从而导致电路受到盐雾、灰尘和水汽等物质的侵蚀,影响电路的使用和寿命。依据有限元法,使用Ansys仿真软件,对大尺寸陶瓷封装器件进行参数化建模,模拟了包括随机振动、机械冲击和恒定加速度在内的结构可靠性试验过程,研究了盖板及焊框厚度对盖板可靠性的影响,得到如下结论:焊框厚度对盖板的可靠性影响较小,增加盖板厚度可以大幅度地提升封装中盖板的可靠性。

The large-size hermetic package device will inevitably be affected by various loads in the process of production,transportation and service.Because the size of the cover plate is too large,it is easy to have reliability problems,which leads to the erosion of the circuit by substances such as salt spray,dust and water vapor,thus affecting the use and life of the circuit.According to the finite element method and Ansys simulation software,the parameterized modeling of large-size ceramic packaging devices is carried out,and the structural reliability test process including random vibration,mechanical shock and constant acceleration is simulated.The influence of cover plate and welding frame thickness on cover plate reliability is studied.And it is concluded that the thickness of the welding frame has little effect on the reliability of the cover plate,and increasing the thickness of the cover plate can greatly improve the reliability of the cover plate in the package.