一种变功耗通信机架的热设计

Thermal Design of a Communication Rack with Variable Power Consumption

综合机架是军用电子设备的常用形式,热设计是综合机架设计过程中的关键环节。针对某型通信综合机架的两种工作模式,从设备的热流密度及机架设计要求方面进行了散热方案的选择与细化设计,并进行了数值仿真分析。仿真结果表明:设备的热设计良好,模块的温控效果达到设计要求;在低功耗模式下采用多风机低转速的方案可获得更经济、更好的散热效果。

Integrated frame is a common form of military electronic equipment,and thermal design is a key link in the process of integrated frame design.Aiming at the two working modes of a communication integrated frame,the heat dissipation scheme is selected and detailed designed from the aspects of heat flux and frame design requirements,and the numerical simulation analysis is carried out.Simulation results show that the thermal design of the equipment is good,the module temperature control effect meets the design requirements,and adopting the multi-fan and low speed in the low power consumption mode can obtain a more economical and better heat dissipation effect.