基于超声波清洗技术的太阳能多晶硅片清洗装置设计

Design of Solar Polysilicon Wafer Cleaning Device Based on Ultrasonic Cleaning Technology

基于超声波清洗技术设计了太阳能多晶硅片清洗装置,并通过实验进行了效果验证,结果表明,超声波清洗装置可高效清洗干净多晶硅片表面污染物,色泽光亮均衡统一,效果显著;清洗前,多晶硅片平均接触角较大,表面疏水性过强,清洗后,平均接触角显著下降,说明基于超声波作用,可有效清洗疏水性污染物,且符合多晶硅片清洗洁净要求;随超声波功率增加,清洗后多晶硅片表面接触角呈现为先逐渐缩小,后有所增大的趋势;超声波清洗装置清洗硅片,可获得更微小的表面粗糙度;清洗后硅片表面只包含硅原子,并未观察发现其他杂质元素污染,表面十分洁净。总之,太阳能多晶硅片超声波清洗装置,操作简洁便捷,清洗效果显著,清洗时间短暂,成本相对偏低,节能环保,环境污染较小。

Based on the ultrasonic cleaning technology,the solar polysilicon wafer cleaning device is designed,and the effect through experiments is verified.The results show that the ultrasonic cleaning device can effectively clean the pollutants on the surface of polysilicon wafer,with uniform bright color and remarkable effect.Before cleaning,the average contact Angle of polysilicon wafers is larger and the surface hydrophobicity is too strong.After cleaning,the average contact Angle significantly decreases,indicating that the hydrophobic pollutants can be effectively cleaned based on the effect of ultrasonic wave,and it conforms to the cleaning and cleaning requirements of polysilicon wafers.With the increase of ultrasonic power,the surface contact Angle of polysilicon wafer decreases and then increases after cleaning.The surface roughness of silicon wafer can be obtained by ultrasonic cleaning device.After cleaning,the surface of the silicon wafer contains only silicon atoms,and no contamination of other impurity elements is found,so the surface is very clean.In short,the solar polysilicon wafer ultrasonic cleaning device is simple and convenient to operate,has significant cleaning effect,short cleaning time,relatively low cost,energy saving and environmental protection,and less environmental pollution.