基于Icepak的板级电路的热设计及热仿真分析

Thermal Design and Thermal Simulation Analysis of Board-level Circuit Based on Icepak

使用Icepak对板级电路建模和仿真以获得板级电路温度的分布,即能够在设计阶段预测板级电路的散热问题。首先建立了某板级电路的热仿真分析模型,然后使用Icepak对热仿真模型进行热仿真获得板级电路的温度场分布情况。Icepak软件的热仿真结果表明,在电路板不同位置时板级电路最高温度最大相差18.18℃,温度降低了18.6%。发热元器件在板级电路不同位置时板级电路温度的差异,为板级电路布局设计提供了一定的理论基础,对板级电路的研发具有重要意义。

Use Icepak to model and simulate board-level circuits to obtain the distribution of board-level circuit temperature,that is,to predict the heat dissipation problems of board-level circuits in the design stage. First,a thermal simulation analysis model of a board-level circuit is established,and then Icepak is used to perform thermal simulation on the thermal simulation model to obtain the temperature field distribution of the board-level circuit. The thermal simulation result of Icepak software shows that the maximum temperature difference of the board-level circuit at different positions on the circuit board is 18. 18℃,and the temperature is reduced by 18. 6%. The temperature difference of the board-level circuit when the heating components are in different positions of the board-level circuit provides a certain theoretical basis for the board-level circuit layout design,and is of great significance to the research and development of the board-level circuit.