SnAgCu系软钎料钎焊接头的熔化特性和力学性能研究

Study on Melting Characteristics and Mechanical Properties of Brazed Joint of SnAgCu Series Soft Solder

文章以Sn2.5Ag0.7Cu0.1系软钎料钎焊接头为基础,制备不同Ni含量的钎料合金,添加了4:1(Ce:La)比例的微量RE(稀土),对软钎料钎焊接头在不同Ni含量下的显微组织、熔化特性、力学性能展开实验。运用钎料完成纯铜钎焊处理后,测试不同Ni含量下的钎料合金钎焊接头蠕变性能,结果发现加入Ni有助于对钎料合金力的纤维组织、力学性能有所提升,但是不会很大程度影响合金熔化特性。本次试验发现了在Ni是0.05%、1%含量情况下,接头的蠕变性能较其他Ni含量明显更优。

In this paper,based on the brazed joint of Sn2.5Ag0.7Cu0.1 series soft solder,the solder alloys with different Ni content were prepared,and the micro RE(rare earth)with the proportion of 4:1(Ce:La)was added.The microstructure,melting characteristics and mechanical properties of the brazed joint with different Ni content were tested.After the pure copper was brazed with filler metal,the creeping properties of brazed joints with different Ni content were tested.The results show that the addition of Ni can improve the fiber microstructure and mechanical properties of solder alloy,but will not affect the melting characteristics of the alloy to a great extent.In this experiment,it is found that when the content of Ni is 0.05%and 1%,the creeping property of the joint is obviously better than other Ni content.