一种柔直换流阀用压接型IGBT功率子模块加速老化试验方法

An Accelerated Aging Test Method of Press-Pack IGBTs Based Power Submodules for VSC-HVDC Converter Valve

压接型绝缘栅双极型晶体管(insulated gate bipolar transistor,IGBT)内部各层材料在导通电流的同时还起到传递热量、承受压力的作用,属于热、电、力多物理场耦合系统。因此,压接型IGBT的老化机理与焊接型IGBT有所不同,需要采取新的试验方法对其开展加速老化试验,进而为老化机理的研究获取更多的分析数据。参考已有的研究方法和成果,针对柔直换流阀用压接型IGBT器件提出了一种多激励类型多特征参数监测的加速老化试验方法,设计了冲击循环、恒定高温、功率循环及温度循环4种类型的激励施加方法,设计试验拓扑并明确试验参数整定原则,全方位激发压接型IGBT的老化失效过程。为多角度监测试验过程中器件退化状态,提出了在线监测方法和周期性离散监测方法,对器件集电极电流、饱和导通压降、散热器壳温等特征参数进行监测。

The press-pack IGBTs(PPIs)is a tightly coupled system of thermal,electrical and mechanical fields,of which the heat and borne pressure are transferred through inner layers while conducting current.Therefore,the aging mechanism of PPIs is different from that of power module IGBTs(PMIs).It is necessary to adopt new test methods to carry out accelerated aging test,as to obtain more analysis data for the research of aging mechanism.In this paper,according to existing references,an accelerated aging testing method with multi-excitation sources and multi-parameter monitors is implemented on the PPIs based on the half-bridge MMC sub-module to figure out the failure process.Combined with characteristics of the chip and package,methods with multi-excitation sources including high junction temperature operating test,impulse cycling test,power cycling test and temperature cycling test are studied,with the test topology and parameter setting principle defined,so as to comprehensively stimulate the aging failure process of PPIs.In order to observe the degradation process of PPIs as far as possible,an on-line monitoring method and a periodic discrete monitoring method are proposed to monitor the characteristic parameters of PPIs,such as the collector current,forward saturation voltage drop and the case temperature of the heat sink.