IGBT用环氧树脂封装料的制备与性能研究

Study on preparation and performance of EP encapsulant for IGBT

以甲基六氢苯酐(MeHHPA)为固化剂,端羧基液体丁腈橡胶(CTBN)为增韧剂,对混合环氧树脂SRTEM-80/REDG-80/E-158进行改性;采用不同用量的硅烷偶联剂KH-570对氧化铝和硅粉复配填料进行改性;最终制备了绝缘栅双极晶体管(IGBT)用环氧树脂封装料。并对封装料的黏度、凝胶化时间、热导率、电气性能、弯曲强度和吸水率等进行测试。研究结果表明,此环氧树脂封装料具有低黏度、良好的绝缘性能和耐湿性等;硅烷偶联剂KH-570用量为1.5%时,封装料的热导率最高为1.191W/(m·K),体积电阻率5.95×10^(15)Ω·m,击穿场强为28.28kV/mm,tgδ为0.62%,弯曲强度为74.32MPa,吸水率小于0.1%;最佳的固化工艺条件为80℃/2h、120℃/2h。

Epoxy resin(EP)SRTEM-80/REDG-80/E-158 was Modified by methyl hexahydrophthalic anhydride(MeHHPA)as curing agent and carboxyl-terminated liquid nitrile rubber(CTBN)as toughening agent.Coupling agent KH-570 modified alumina and silica powder compounding filler were used to prepare EP encapsulant for IGBT.The viscosity,gelation time,thermal conductivity,electrical properties,flexural strength of the encapsulant,water absorption and so on were tested.The research shown that the EP encapsulant had low viscosity,insulation performance,moisture resistance,etc..When the amount of silane coupling agent KH-570 was 1.5%,the thermal conductivity of the encapsulant was 1.191 W,and the volume resistivity was 5.95×10^(15)Ω·m.The breakdown field strength was 28.28 kV/mm,the tgδwas 0.62%,the bending strength was 74.32 MPa,and the water absorption was less than 0.1%.The best curing process was 80℃/2 h,120℃/2 h.