基于水辅助的飞秒激光碳化硅微孔加工(特邀)

Water-assisted Femtosecond Laser Silicon Carbide Micro-hole Machining(Invited)

在350μm厚的碳化硅样品上加工了直径200μm的微孔,研究了基于水辅助的飞秒激光碳化硅微孔加工方法。探讨了空气中加工微孔与水辅助加工微孔的差别。水降低了加工区域的温度,大大减少了氧化反应的发生,而且加工产生的碎屑由水带走,避免了热影响区的形成,降低了样品粗糙度。加工出的微孔侧壁光滑,无热影响区,在工业中有实际应用的价值。该加工方法使加工形貌良好的碳化硅微孔成为现实,有望应用于碳化硅的工业加工中。

A water-assisted femtosecond laser silicon carbide micro-hole machining method is proposed,and a 200μm diameter micro-hole is processed on a 350μm thick silicon carbide sample.The difference between processing micro-holes in air and water-assisted processing of micro-holes is discussed.Water reduces the temperature of the processing area,greatly reducing the occurrence of oxidation reactions.The debris produced by processing is taken away by the water,avoiding the formation of HAZ and reducing the roughness of the sample.The processed micro-holes have smooth sidewalls and no HAZ,which has practical application value in industry.The processing method makes it a reality to process silicon carbide micropores with good morphology,and is expected to be applied to the industrial processing of silicon carbide.