功率器件引线键合参数研究

Research on Parameters of Wire Bonding for Power Devices

引线键合作为芯片封装的关键工艺,其键合质量直接影响器件性能。功率器件普遍采用粗铝丝超声楔形键合,对芯片区域第一键合点和第二键合点键合工艺参数进行了系统研究,并以剪切力作为衡量键合质量的方法,采用单因子分析法,研究各个参数对键合点强度的影响,利用正交试验方法,确定最优参数,并比较两类键合点的差异,为该领域引线键合工艺参数设定提供参考。

As the key process of chip packaging,the quality of wire bonding directly affects the performance of the device.Generally,thick aluminum wire is used in ultrasonic wedge bonding for power devices.Technical parameters of the first bond and the second bond on the chip are systematically studied and shear force are used as a method to measure bonding quality.Effect of technical parameters on bonding strength is analyzed with single factor analysis.The optimal parameter is determinated and the differences between the two types of bonds are compared with orthogonal experiment method,which providing a reference for setting parameters of wire bonding in this field.