自动光学检测设备的产率优化研究

Research on Optimizing the Yield of Automatic Optical Inspection Equipment

传统的芯片生产过程中,芯片表面缺陷会影响后续制程工艺的良率,因此产线中会使用自动光学检测设备对芯片表面进行缺陷检测和返工处理,从而实现良率管控。由于芯片表面缺陷的形貌特征不一,常采用明场照明和暗场照明的方式进行组合检测。本文通过对检测流程的产率研究,改进现有的扫描检测流程,以期提升产率。经过客户端的试验验证,经作者改进之后的检测流程方案可以符合客户产率提升的实际需求,并且帮助公司提升了产品设备竞争力。

In the traditional chip production process,chip surface defects will affect the yield of subsequent manufac⁃turing processes,therefore,automatic optical inspection equipment will be used in the production line to detect de⁃fects and rework the chip surface to achieve yield control.Due to the different morphological characteristics of chip surface defects,bright field illumination and dark field illumination are often used for combined inspection.In this paper,through the research on the production rate of the detection process,the existing scanning detection process was improved in order to increase the production rate.After the client's test verification,the inspection process scheme improved by the author can meet the actual needs of customers for increasing the productivity,and help the company improve the competitiveness of products and equipment.