等离子体增强原子层沉积增透阻隔膜的研究

Study of Antireflection and Barrier Films Prepared by Plasma-Enhanced Atomic Layer Deposition

高阻隔高透光率的柔性复合材料在包装和电子封装领域具有很高的应用价值。本文采用等离子增强原子层沉积技术在PET基体上制备了多层结构的增透阻隔膜,研究了等离子增强原子层沉积制备氧化硅和氮化硅的工艺参数,利用光学模拟软件设计出所需透过率的膜层结构。结果表明:等离子体增强原子层沉积制备的薄膜原子力显微镜表面形貌晶粒分布均匀,薄膜致密,红外光谱显示制备的薄膜为高纯度的SiO_(2)和Si_(3)N_(4),薄膜的透水率降低了2个数量级,可见光范围透过率可达到94%。

Flexible composite materials with high barrier and high light transmittance have high application value in packaging and electronic packaging.In this paper,plasma-enhanced atomic layer deposition technology was used to prepare a multilayer antireflection barrier film on the PET substrate.The process parameters of plasmaenhanced atomic layer deposition to prepare silicon oxide and silicon nitride were studied,and optical simulation software was used to design the required transparency film structure.The results show that the surface morphology of the film AFM prepared by plasma enhanced atomic layer deposition is uniform and the film is dense.The infrared spectrum shows that the prepared film is high-purity SiO_(2) and Si_(3)N_(4).The water permeability of the film is reduced by 2 orders of magnitude,and the visible light range The transmittance can reach 94%.