镀层类型及厚度对连接器端子插拔力的影响

Influence of Plating Type and Thickness on Insertion and Retention Force of Connector Terminal

以安波福OCS 064端子为研究对象,对比分析了雾锡、回流亮锡、锡铅、银、金和钯镍闪金6种不同镀层对公端端子插拔力的影响。结果表明:电镀金与钯镍闪金后端子表面较硬,其他电镀类型变软,锡铅最软;金有较好的插拔力性能,锡铅相对较差。镀后镀层表面硬度比镀前软,且底层镍越厚硬度越硬;镀后插入力比镀前大,由于尺寸及粗糙度的关系底层镍越厚插入力越大;镀后拔出力比镀前大,但镀后的拔出力与底层镍厚度没有必然的关系。镀后镀层表面硬度比镀前软,且顶层雾锡越厚硬度越硬;镀后比镀前粗糙,但顶层雾锡越厚表面越光滑;镀后插入力比镀前大,且顶层雾锡越厚插入力越大;镀后拔出力比镀前大,但顶层雾锡越厚拔出力反而越小。

Taking Aptiv OCS 064 female terminal as the research object,the effects of six different plating type on the male terminal insertion and retention force were compared and analyzed,including matte tin,reflow tin,tin lead,silver,gold,palladium/nickel plus gold flash.The results show that the surface of the terminal is hard after gold plating and palladium/nickel plus gold flash plating,and the other electroplating types become soft,and tin lead is the softest;gold has better performance of insertion and retention,while tin lead are relatively poor.The surface hardness of the coating after plating is softer than that before plating,and the thicker the nickel layer is,the harder the hardness is.The insertion force after plating is larger than that before plating.Due to the size and roughness,the thicker the nickel substrate is,the greater the insertion force is.The retention force after plating is larger than that before plating,but there is no necessary relationship between the retention force after plating and the thickness of nickel substrate.The surface hardness of the coating after plating is softer than that before plating,and the thicker the top layer is,the harder the hardness is.However,the thicker the top layer is,the smoother the surface is.The insertion force after plating is larger than that before plating,and the thicker the top layer is,the greater the insertion force is.The retention force after plating is larger than that before plating,but the thicker the top layer is,the smaller the retention force is.