期刊文献+

冲击射流冷却高功率电子元件的试验研究

Experimental study on impinging jet cooling of high power electronic components
下载PDF
导出
摘要 电子产品的发展趋势是运行速度快、发热功率大、体积小,散热能力对其性能影响很大。冲击射流因其冷却效果好被广泛用于冷却电子产品。基于冲击射流冷却技术,设计搭建了一个空气冲击射流冷却试验装置,通过试验研究了加热功率、射流温度、喷嘴与壁面间距离和喷嘴直径对空气冲击射流换热的影响:加热功率在15.7~49.0 W范围内,沿径向壁面温度均先降后升、换热系数先增后减;随着加热功率增大,壁面径向温度分布越不均匀、平均温度升高,对换热系数没有影响;射流温度一定,沿径向壁面温度先降后升、局部换热系数先增后减;随着射流温度升高,壁面平均温度小幅升高、径向温度分布越均匀,空气物性发生变化,换热系数略有提高,但换热系数的最大值位置不变。 The development trend of electronic products is fast running,high heating power and small volume.Its heat dissipation capacity has a great impact on its performance.Impinging jet is widely used to cool electronic products because of its good cooling effect.Based on impinging jet cooling technology,an air impinging jet cooling experimental device was designed and built.The effects of heating power,jet temperature,distance between nozzle and wall and nozzle diameter on the heat transfer of air impinging jet were studied experimentally:when the heating power is between 15.7 W and 49.0 W,the radial wall temperature first decreases and then rises,and the heat transfer coefficient increases first and then decreases;with the increase of heating power,the radial temperature distribution becomes more uneven and the average temperature increases,which has no effect on the heat transfer coefficient;when the jet temperature is constant,the wall temperature decreases first and then increases and then decreases;with the increase of jet temperature,the wall surface is flat When the average temperature increases slightly and the radial temperature distribution is more uniform,the air physical properties change and the heat transfer coefficient increases slightly,but the position of the maximum value of the heat transfer coefficient remains unchanged.
作者 吕静 黄伶俐 刘洪芝 吕艈昶 LYU Jing;HUANG Lingli;LIU Hongzhi;LYU Yuchang(School of Environment and Architecture,University of Shanghai for Science and Technology,Shanghai 200093,China)
出处 《流体机械》 CSCD 北大核心 2021年第6期1-8,21,共9页 Fluid Machinery
基金 国家自然科学基金青年项目(51906157)。
关键词 电子元件 射流冷却 换热特性 electronic components jet cooling heat transfer characteristics
  • 相关文献

参考文献1

二级参考文献11

  • 1秦曼,郑青,马重芳,雷道亨.FC—72圆形射流冲击模拟电子芯片单相局部对流传热的实验研究[J].工程热物理学报,1996,17(1):69-74. 被引量:17
  • 2吴建国 池桂馨.喷流换热的最佳结构参数[J].冶金能源,1982,1(2):47-50.
  • 3Faggiani S, Grass W. Impinging Liquid Jets on Heated Surface. Keynote Report, 9th Int. Heat Transfer Conference: Tel Aviv, Israel, August 1990:19 - 24.
  • 4Goldstein R. J, Franchett ME. Heat transfer from a fiat surface to an oblique impinging jet. Trans ASME J Heat Transfer, 1988, 110: 84.
  • 5Viskanta R. Heat transfer to impinging isothermal gas and flame jets.Experimental Thermal and Huid Science, 1993, 6:111 - 134.
  • 6Ma CF, Zheng Q. Local Heat Transfer and recovery factor with impinging free - surface circular jets of transformer oil Int. J. Heat Mass Transfer,1997, 40(8): 4295 - 4308.
  • 7Ma CF, et al. Local characteristics of impingement heat transfer with oblique round free - surface jets of large Prandtl number liquid. Int. J.Heat Mass Transfer, 1997, 40(10): 2249 -2259.
  • 8Zhang jingzhou, Li liguo, High - resolution heat transfer coefficients measurement for jet impingement using thermochromic liquid crystals. Chinese Journal of Aeronautics. Vol. 14, No. 4, 2001.
  • 9D. E. Metzger et al. Impingement cooling of concave surface wiry lince of circular air jets. J. Eng. for Power, 91,149(1969).
  • 10郑际睿 王宝官.模氦透平叶片冲击冷却的实验研究[J].工程热物理学报,1980,1(2):165-175.

共引文献20

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部