铜-硼/金刚石复合材料翅片热沉散热研究

Research on Heat Dissipation of Cu-B/Diamond Composite Fin Heat Sink

采用气压浸渗法制备了热导率为850 W·m^(-1)·K^(-1)的铜-硼/金刚石复合材料翅片热沉,测试了其在自然冷却、强迫风冷和强迫水冷三种冷却模式下的散热效果。结果表明,热源功率越高,铜-硼/金刚石复合材料的散热效果越显著。在强迫水冷模式下,当加热片的输入功率为80 W时,使用铜-硼/金刚石复合材料翅片热沉时加热片的最高温度比使用铜翅片热沉时低14℃,比使用铝翅片热沉时低23℃。Icepak热模拟发现,在强迫水冷模式下输入功率为80 W时,与铜和铝翅片热沉相比,铜-硼/金刚石复合材料翅片热沉的整体温度更低且温度分布更均匀。研究结果证实,铜-硼/金刚石复合材料是一种高效的散热材料,在大功率电子器件散热中具有广阔的应用前景。

A Cu-B/diamond composite fin heat sink with a thermal conductivity of 850 W·m^(-1)·K^(-1)was prepared by the gas pressure infiltration method.The heat dissipation effects of the Cu-B/diamond composite fin heat sink were measured in three cooling modes of natural cooling,forced-air cooling and forced-water cooling.The results show that the higher the power of the heat source,the more significant the heat dissipation effect of the Cu-B/diamond composite.In the forced-water cooling mode,the maximum temperature of the heating plate with the Cu-B/diamond composite fin heat sink is 14℃lower than that with the Cu fin heat sink,and is 23℃lower than that with the Al fin heat sink when the input power of the heating plate is 80 W.The Icepak thermal simulation indicates that when the input power is 80 W in the forced-water cooling mode,the overall temperature of the Cu-B/diamond composite fin heat sink is lower and the temperature distribution is more uniform than that of Cu and Al fin heat sinks.The results confirm that Cu-B/diamond composite is an efficient heat dissipation material and has broad application prospects in the heat dissipation of high power electronic devices.