碳纤维表面溅射金属增强铜基复合材料的界面结合

Interficial Bonding within Cu-based Composites Reinforced with TiC-or Ni-coated Carbon Fiber

先分别在碳纤维表面磁控溅射镀覆厚度约0.8 mm均匀分布的TiC和Ni,然后用传统粉末冶金技术制备碳纤维(体积分数为2.5%)增强铜基复合材料。结果表明,铜基复合材料的力学性能与电性能协同提高。碳纤维在基体中分布均匀,没有出现明显的偏聚。溅射钛的碳纤维增强复合材料的硬度和电性能分别为40.8HV和91.0%IACS,溅射镍的碳纤维增强复合材料的硬度和电性能分别为38.8HV和79.7%IACS。在结合界面Ti与C或Ni与Cu发生反应,都有利于界面结合。

Carbon fibers were coated with thin film of TiC and Ni respectively of about 0.8 mm in thickness by means of magnetron sputtering technique. Then the Cu-based composites reinforced with 2.5 %(volume fraction) coated carbon fibers were prepared by traditional powder metallurgy technology.The results show that the mechanical and electrical properties of Cu-based composites were improved through the reinforcements. The carbon fibers were homogeneously distributed in the matrix without obvious segregation. The hardness and electrical properties of the composite with reinforcer of TiC film coated carbon fibers were 40.8 HV and 91.0%IACS, respectively, and those of Ni film coated carbon fibers were 38.8 HV and 79.7%IACS, respectively. It follows that interaction of couples Ti/C and Ni/Cu respectively at interfaces of coated thin film/carbon fiber/Cu-matrix could be confirmed, which is beneficial to the interfacial bonding strength.