半导体光学薄膜材料的损伤程度因素分析

Study on the automatic detection of the damage of semiconductor optical thin films

半导体光学薄膜材料是当前研究的热点,针对损伤程度直接影响半导体光学薄膜材料质量,为获得更好的半导体光学薄膜材料,减少半导体光学薄膜材料损伤的面积,提出基于数据挖掘技术的半导体光学薄膜材料的损伤程度因素分析方法。通过数据挖掘技术拟合半导体光学薄膜材料质量与其影响因素之间的映射关系,找到影响半导体光学薄膜材料损伤面积的主要影响,最后与其它半导体光学薄膜材料损伤程度分析方法进行对比测试,本方法可以更好地检测到半导体光学薄膜材料损伤面积,消除一些不利因素的影响,获得高质量的半导体光学薄膜材料,实际应用价值更高。

Semiconductor optical thin film materials are the focus of current research.In order to obtain better semiconductor optical thin film materials and reduce the damage area of semiconductor optical thin film materials,this paper proposes a method based on data mining technology to analyze the damage degree factors of semiconductor optical thin film materials.Through the data mining technology to fit the mapping relationship between the quality of semiconductor optical thin film materials and its influencing factors,the main influence on the damage area of semiconductor optical thin film materials is found.Finally,compared with other damage degree analysis methods of semiconductor optical thin film materials,the method in this paper can better detect the damage area of semiconductor optical thin film materials and eliminate it Under the influence of some unfavorable factors,obtain high quality semiconductor optical thin films,which have higher practical application value.