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热压烧结工艺对AlN陶瓷显微结构及性能的影响 被引量:1

Effects of Hot Pressing Sintering Process on Microstructure and Properties of AlN Ceramics
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摘要 以直接氮化法制备的AlN粉体为原材料,添加质量分数为5%的Y_(2)O_(3)做烧结助剂,采用热压烧结工艺制备AlN陶瓷。研究烧结温度和压力对AlN陶瓷显微结构、相对密度和热导率的影响。结果表明:随着烧结温度的升高,AlN陶瓷的晶粒长大,第二相逐渐增多,热导率和相对密度均为先增大后减小;随着压力的增大,AlN陶瓷的晶粒逐渐细小,气孔率减少,热导率和相对密度都显著增大。确定AlN陶瓷的最优烧结条件如下:温度为1800℃,压力为50 MPa。 AlN ceramics were prepared by hot pressing sintering process with AlN powder prepared by direct nitriding method as raw material and Y2O3 with mass fraction of 5%as sintering assistant.The effects of sintering temperature and pressure on the microstructure,relative density and thermal conductivity of AlN ceramics were studied.The results showed that with the increase of temperature,the grain size of AlN ceramics grew,and the second phase gradually increased.The thermal conductivity and relative density of AlN ceramics first increased and then decreased.With the increase of pressure,the grain size of AlN ceramics gradually became smaller,the porosity decreased,and the thermal conductivity and relative density increased significantly.The optimal sintering conditions of AlN ceramics were as follows:the temperature of 1800℃,and the pressure of 50 MPa.
作者 唐少炎 胡文俏 胡木林 TANG Shaoyan;HU Wenqiao;HU Mulin(College of Packaging and Materials Engineering,Hunan University of Technology,Zhuzhou Hunan 412007,China;College of Materials,Huazhong University of Science and Technology,Wuhan 430000,China)
出处 《包装学报》 2021年第3期64-70,共7页 Packaging Journal
关键词 氮化铝陶瓷 烧结温度 烧结压力 热导率 相对密度 AlN ceramics sintering temperature sintering pressure thermal conductivity relative density
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