Sn/Cu互连界面化合物在固-液扩散条件下的生长

Growth of Sn/Cu interconnect interface compounds under solid-liquid diffusion

文中考察了Sn/Cu互连界面在固-液扩散过程中的界面反应动力学、热力学行为,考察了固-液反应时间、温度对Sn/Cu界面化合物的影响,分析了不同温度条件下(250,280,310℃)化合物的生长速率,并在该温度范围内计算了Sn/Cu界面化合物的生长激活能数据,得到界面化合物在固-液扩散条件下随时间的延长受制于扩散过程的结论。其激活能约为固态保温条件下激活能的一半,扩散系数则比固态时效的高约34个数量级。

The kinetics and thermodynamics of Sn/Cu interface reaction during solid-liquid diffusion were investigated. The effects of holding time and temperature under solid-liquiddiffusion on the evolution of Sn/Cu interface compounds were observed. The growth rates of the compounds at different temperatures(250 ℃, 280 ℃ and 310 ℃) were analyzed. The activation energy data of the Sn/Cu interface compounds were calculated in this temperature range. It was found that the growth of the compounds with time was controlled by the diffusion process under the condition of solid-liquid diffusion. The activation energy was about half of that of solid aging, and the diffusion coefficient was about 3 ~ 4 orders of magnitude higher than that of solid aging.