基于ANSYS的电子功能部件热可靠性仿真预计

ANSYA-based Thermal Reliability Simulation Prediction of Electronic Functional Components

常规试验方法对于弹上电子功能部件热可靠性的分析验证,不仅所需周期长、代价大,而且容易受到试验设备及人员素质的限制,往往导致数据数量和质量的双重折扣。为此,基于ANSYS对借助于贴片式电子元器件改造的电子功能部件进行热可靠性仿真预计。通过设置不同的环境温度,模拟电子功能部件服役期不同的工作状态,并结合失效率预计模型,计算关键元器件服役期内3种阶段的热失效率,实现对于改造的电子功能部件的热可靠性预计,同时利用加速退化试验验证其准确性。仿真结果表明,热可靠度为0.9834,远大于规定的服役期热可靠标准,印证了贴片式电子元器件应用的可行性。

The conventional test method for the analysis and verification of the electronic functional components’thermal reliability on the missile not only requires a long cycle and high cost,but also is easily limited by the quality of the test equipment and person,and often results in a double decrease in the quantity and quality of data.For this reason,this paper uses ANSYS to perform thermal reliability simulation prediction of electronic functional parts modified by SMD electronic components,and sets different environmental temperatures to simulate different working states of electronic functional components throughout their period of service.The failure rate prediction model is combined with to calculate the failure rate of key components,in 3 kinds of phases so as to realize the thermal reliability prediction of upgraded electronic functional components.At the same time,the accelerated degradation test is used to verify its accuracy.The simulation results show that the thermal reliability of the electronic functional components over the entire period of service is 0.9834,which is far greater than the prescribed thermal reliability standard in service period,and verifies the feasibility of the application of SMD electronic components.