Fe颗粒含量对Sn35Bi/Cu钎焊接头组织性能影响

Effect of Fe particle content on microstructure and properties of Sn35Bi/Cu brazed joints

采用扫描电镜(SEM)、能谱仪(EDS)以及万能力学试验机等研究了Fe颗粒含量对Sn35Bi-xFe/Cu钎焊接头组织和性能的影响,并研究了Fe颗粒含量对Sn35Bi-Fe合金钎料的铺展面积和润湿性的影响。结果表明:向Sn35Bi合金钎料中加入少量Fe颗粒,会在Fe颗粒周围生成很薄的FeSn2化合物,降低固相/液相的界面能,提高相的形核率,细化接头的组织;当Fe颗粒含量为1 mass%时,接头组织的细化程度最佳;向Sn35Bi合金钎料中加入Fe颗粒,可以有效提高合金钎料的润湿性和力学性能,当Fe含量为1 mass%时,Sn35Bi-1Fe合金钎料的铺展面积最大,润湿角最小,润湿性能最佳,Sn35Bi-1Fe/Cu接头的剪切强度达到最大,为50.23 MPa,与Sn35Bi/Cu接头相比,提高了37.7%。

Effect of Fe particle content on microstructure and properties of SnBi-xFe/Cu(x=0%,0.3%,0.7%,1.0% and 1.5%) brazed joints was studied by means of scanning electron microscopy(SEM), energy dispersive spectrometer(EDS) analysis and universal mechanical testing machine, and the effect of Fe particle content on spreading area and wettability of SnBi-Fe alloy brazing materials was also investigated. The results show that adding a small amount of Fe particles to the Sn35 Bi alloy solder will produce a very thin FeSn2 compound around the Fe particles, reduce the interfacial energy of the solid/liquid phase, increase the nucleation rate of the phase, and refine the microstructure of the joint. When the Fe particle content is 1 mass%, the microstructure of the brazed joint is best refined. The addition of Fe particles to the Sn35 Bi alloy solder can effectively improve the wettability and mechanical properties of the alloy solder. When the Fe particle content is 1 mass%, the spreading area of the Sn35 Bi-1 Fe alloy solder is the largest, the wetting angle is the smallest, the wetting property is the best, and the shear strength of the Sn35 Bi-1 Fe/Cu joint reaches the maximum value, which is 50.23 MPa, which is 37.7% higher than that of the Sn35 Bi/Cu joint.