蓝宝石衬底片背面减薄磨削加工试验分析

Test Analysis on Thinning & Grinding Process of Back Surface of Sapphire Substrate

为分析磨削加工对发光二极管蓝宝石衬底片背面减薄加工质量的影响,采用行业内主流的磨削设备进行磨削加工试验。在试验中,分析砂轮转速、磨削进给量、冷却水温度等对蓝宝石衬底片背面减薄磨削加工质量的影响。试验表明,砂轮转速适当提高,有助于提高蓝宝石衬底片背面减薄磨削加工的合格率,但若转速过高,则合格率反而会降低;蓝宝石衬底片目标厚度不同,所采用的磨削进给量也不相同;在兼顾加工效率的情况下,薄尺寸蓝宝石衬底片适合低速进给,厚尺寸蓝宝石衬底片背面减薄磨削加工时可适当提高进给速度;冷却水温度升高,蓝宝石衬底片背面减薄磨削加工的合格率降低,冷却水温度不应高于29℃。

In order to analyze the impact of the grinding process on the quality of the thinning process of the back surface of the LED sapphire substrate,the grinding test was carried out with the mainstream grinding equipment in the industry.In the test,the influence of grinding wheel speed,grinding feed rate,cooling water temperature,etc.on the quality of the thinning&grinding process of the back surface of sapphire substrate was analyzed.Tests have shown that an appropriate increase in the speed of the grinding wheel will help increase the pass rate of the thinning&grinding process of the back surface of sapphire substrate,but if the speed is too high,the pass rate will decrease instead.The target thickness of the sapphire substrate is different,and the adopted feed rate for grinding is also different.In the case of taking into account the processing efficiency,the thin sapphire substrate is suitable for low—speed feeding,and the feed rate can be appropriately increased during the thinning&grinding of the back surface of thick sapphire substrate.As the cooling water temperature rises,the pass rate of the thinning&grinding process of the back surface of sapphire substrate will decrease,and the cooling water temperature should not be higher than 29℃.