奇数层多层印电路板板翘改善

Improvement of warpage of odd multilayer PCB

多层板奇数层结构由于压合结构不对称,容易使多层电路板翘曲。本文针对三层板类似不对称压合结构跟进,在不影响客户设计的原则上给予调整,使其降低成品板子翘曲度,满足客户使用需求。

Because of the unsymmetrical lamination structure,the odd layer structure of multilayer board is prone to warp.In this paper,the similar unsymmetrical lamination structure of the three-layer board is followed up,which is adjusted on the principle of not affecting the customer's design,so as to reduce the warpage of the finished board and meet the customer's needs.