自动光学检测在引线键合中的应用

Application of Automatic Optical Inspection in Wire Bonding

在多芯片组件组装过程中,引线键合的自动光学检测存在背景图像复杂、跨尺度检测难度大和压点方向随机等问题。进行了光源参数和图像处理算法优化,通过键合球、引线和键合压点等三部分的分段检测,实现了自动光学检测技术在引线键合工艺中的应用。通过某型多芯片组件组装过程的检测得到数据,统计结果表明:与人工目检相比,检测效率提升了240%(离线生产),漏检率由200×10^(-6)降至5×10^(-6)以下,可有效降低目检操作者的劳动强度,可统计分析缺陷类型,为引线键合的工艺改进、质量提升和数字化生产提供了基础数据。

In the assembly process of multi-chip modules,the automatic optical detection for wire bonding has some problems,such as complex image background,difficulty in cross-scale detection and random direction of bonding stitches.The parameters of light source and algorithm of image processing have been optimized,meanwhile,the automatic optical inspection for wire bonding have been segmented to three part as bonding balls,bonding line and bonding stitches.The application of automatic optical detection technology in wire bonding process has been realized.The statistics of the detection data is obtained during a certain type of multi-chip module assembly process,the results show that compared with manual visual inspection,the detection effi ciency is increased to 240%(offl ine)and the false negative rate is reduced from 200×10^(-6) to less than 5×10^(-6),the labor intensity of visual inspection operators can be effectively reduced,and the types of failures can be statistically analyzed to provide basic data for process improvement,quality improvement and digital product.