高可靠性微电子装备用焊膏理-化性能定型认证试验

Physical and Chemical Properties Certification Test of Solder Paste with High Reliability for Microelectronic Equipment

介绍了“国内高可靠性微电子装备用焊膏”研制工程第三阶段的部分工作,针对第二阶段研配成功的三款无铅焊膏和三款有铅焊膏进行全面的物理化学性能分析,包括焊膏的金属部分、助焊膏部分和焊膏整体性能在内的17个性能表征项目的验证及分析,并将验证数据进行统计分析,对新品焊膏理化性能进行定型认证。同时,为高可靠性微电子工艺用焊膏的性能检测提供了方法。

The part of the work in the third stage of research and development of domestic solder paste with high reliability for microelectronic equipment is introduced.The physical and chemical properties of three kinds of lead-free solder paste and three kinds of lead solder paste developed in the second stage are analyzed comprehensively,including the verification and analysis of 17 items,including the metal part performance of solder paste,the partial performance of solder paste and the overall performance of solder paste.The research data are summarized and analyzed,and the type certification of physical and chemical properties of new solder paste is completed.At the same time,it provides a method for testing the performance of high reliability solder paste for microelectronic process.