波峰焊接通孔填充不良问题研究

Study on Poor Through Tole Fill in Wave Soldering

通孔填充不良一直是PCB焊接的难题,在波峰焊、回流焊、选择性波峰焊工艺中都存在,通孔填充不良会降低焊点机械强度,影响导电性能,填充不良是由多种影响因素综合作用形成的,该文以电子行业广泛应用的波峰焊接工艺为例,对通孔填充不良问题进行系统分析,找出影响波峰焊通孔填充性的关键因素,对分析过程中的发现的问题提出改善措施。

Poor filling of through holes has always been a problem in PCB soldering.It exists in wave soldering,reflow soldering,and selective wave soldering processes.Poor filling of through holes will reduce the mecha nical strength of the solder joints and affect the electrical conductivity.Poor filling is caused by many.This paper takes the wave soldering process widely used in the electronics industry as an example to systematically analyze the problem of poor filling of through holes,find out the key factors affecting the filling of wave solder through holes,and find out what is found in the analysis process.The problem proposes improvement measures.