某舰载电子机箱的散热设计

Thermal Design of a Shipboard Electronic Chassis

舰载电子设备长期处于高温、高湿的恶劣环境,为了满足不断提高的功能和性能要求,设备机箱主要采用密闭机箱的形式。与通风机箱相比,密闭机箱散热困难,特别是小尺寸、大热耗的电子设备,其散热设计难度更大。文中以某舰载大功率密闭机箱为研究对象,通过热学分析和理论计算确定散热方案,再通过Flotherm软件建模、网格划分、仿真分析等验证理论计算的正确性,最后通过试验对仿真结果进行校核。此研究能够为小尺寸、大功率密闭机箱的热设计提供参考。

Shipboard electronic equipment operates in a severe environment of high temperature and high humidity for a long time.In order to meet the increasing requirements of function and performance,the chassis mainly adopts the sealed form.Compared with the ventilation chassis,the sealed chassis is more difficult to dissipate heat,especially for the electronic equipment with small size and large heat consumption.In this paper,a shipboard high-power sealed chassis is studied.The scheme of heat dissipation is determined by the thermal analysis and theoretical calculation.The correctness of the theoretical calculation is verified by Flotherm software modeling,grid division,simulation analysis and so on.Finally,the simulation results are checked by experiments.This study provides a reference for the thermal design of small-size and high-power sealed chassis.