416高密载板CSP模块卡片封装工艺技术研究

Research on card packaging technology of 416 high density carrier's chip scale package module

随着国内智能卡行业的高速发展,其应用越来越广泛,人们的日常生活、工作已离不开智能卡。但智能卡相关的材料、设备等,以国外为主,打破垄断、提高国产化率是当务之急。其中载带领域,自主研发的CSP载板模块已初具成效,对比传统条带的模块,生产工艺和成本优势明显。但随着国产条带的发展,其成本优势逐步缩小,因此,一方面需要进一步扩大CSP工艺的成本优势,另一方面,随着人工成本的不断上浮,用工难问题的不断凸显,提高设备自动化减少手工操作势在必行。通过416高密载板CSP模块卡片封装工艺研发项目,可以实现更低成本、更高效率、更智能化的制卡生产工艺。

With the rapid development of domestic smart card,its application is more and more widely,people's daily life and work have been inseparable from the card.However,the materials and equipment related to smart card are mainly from abroad.In order to break the monopoly,it is an urgent task to improve the localization rate.In the carrier field,the CSP carrier module developed independently has achieved initial results.Compared with the traditional strip module,the production process and cost advantages are obvious.However,with the development of domestic strip,its cost advantage is gradually reduced.Therefore,on the one hand,the cost advantage of CSP process is further expanded.On the other hand,with the rising of labor costs and the increasing difficulty of labor,it is imperative to improve e-quipment automation and reduce manual operation.Through the 416 high density carrier CSP module card packaging technology research and development project,we can achieve a lower cost,more efficient,more intelligent smart card printing production process.