细线径漆包线圈键合工艺优化及可靠性分析

Process Optimization and Reliability Analysis for Small Diameter Enameled Wire Bonding

以多芯片组件中常用到的细线径漆包线圈为研究对象,对影响其键合可靠性的各因素进行了研究。结果表明:线圈引脚搪锡后去除卤素元素、键合后涂覆或线圈直接键合法,可避免发生电化学反应腐蚀;合理的键合参数和漆包线圈引脚变形量的控制能减小引脚根部应力;适当的点胶加固措施,可避免线圈产生谐振而受损;调试时不应拨动漆包线圈,以避免本体松散及引脚折弯等情况。

Small diameter enameled wire is normally used as an inductor in MMIC,the factors infl uencing its bonding reliability are studied.The results show that electrochemical corrosion could be avoided by halogen eliminating after tin-coating,parylene coating after bonding or directly soldering.The lead foot stress can be reduced by reasonable bonding parameters and control of the lead deformation.Proper reinforcement measures can prevent the enameled wire from being damaged due to resonance.During debugging,the enameled wire should not be moved to avoid loosening body and bending of the leads.