Pb/Sn/Ag焊料-Pd/Ag导体微观形貌随温度的演变

Microstructure Evolution in Pb/Sn/Ag Solder and Pd/Ag Conductor with Different Temperature Stored Processes

研究了不同高温存储过程对Pb/Sn/Ag焊料-Pd/Ag导体微观界面的影响。通过光学显微镜观察焊料-导体系统的微观形貌随高温过程的演变,借助扫描电子显微镜进行微观界面元素分析,获得Pb/Sn/Ag焊料-Pd/Ag导体间的元素扩散状态。同时探讨了不同温度条件下存储时间与扩散层厚度的关系。研究表明:在高温作用下,焊料和导体间发生互扩散,形成一个元素呈阶梯分布的互扩散层,随着高温时间的延长,扩散层逐渐变厚,当导体层完全消失时,焊料-导体间形成一个互扩散的稳定扩散层。焊料-导体界面随存储温度和时间的演变规律可以为微组装模块的温度应用提供理论基础。

The effects of different high temperature stored processes on the micro-interface of Pb/Sn/Ag solder-Pd/Ag conductor are studied.The microstructure evolution of the solder-conductor system with high temperature is observed by optical microscope,and the element diffusion state between Pb/Sn/Ag solder and Pd/Ag conductor is obtained by means of microscopic interfacial element analysis with scanning electron microscope,the relationship between storage time and diffusion layer thickness is also discussed.The results show that under the action of high temperature,the solder and conductor have mutual diffusion,an inter-diffusion layer with step distribution of elements is formed.With the extension of high temperature time,the diffusion layer gradually thickens.When the conductor layer completely disappears,a stable diffusion layer are formed between the solder and conductor.The evolution of the solder-conductor interface with storage temperature and time can provide a theoretical basis for the temperature application of micro-assembled modules.