基于Weibull分布2.5D封装热疲劳可靠性评估

Thermal Fatigue Reliability Evaluation of 2.5D Package based on Weibull Distribution

针对2.5D立体封装中热膨胀系数及结构尺寸均存在较大差异、极易在热应力作用下产生热疲劳失效的可靠性问题,开展多芯片硅基集成封装互连界面温度循环加速试验,并基于Weibull分布对2.5D封装互连界面热适配性能进行评估分析,实现了2.5D封装可靠性指标的评估和失效率鉴定方案的制定。

Aiming at the reliability problems of 2.5D stereoscopic package including multi-level interconnection structure,large difference in thermal expansion coefficient and structure size,and thermal fatigue failure due to thermal mismatch under thermal stress,the temperature cycling accelerated test of interconnection interface of multi chip silicon-based integrated package was carried out,and the thermal adaptation performance of 2.5D package interconnection interface was evaluated and analyzed based on Weibull distribution.The evaluation of 2.5D package reliability index and the formulation of failure rate identification scheme are realized.