中国集成电路产业创新产出的分布特征及影响因素

Distribution Characteristics and Influencing Factors of Innovation Output in China’s Integrated Circuit Industry

利用区位基尼系数、空间自相关和负二项回归方法,研究2011—2019年间中国31个省(区、市)集成电路产业创新产出的分布特征及影响因素。结果表明:全国、东部、东北创新产出的集聚程度不断增强,西部和中部的集聚程度不断减弱;全国各地区创新产出呈现显著的正向空间集聚特征,莫兰指数Moran’s I呈现"W"型波动特征;低-低集聚区主要分布在西部,低-高集聚区则主要分布在中东部,高-高集聚区集中于长三角,高-低集聚区集中在北京、广东;经济基础、产业结构、科技人员、教育水平和政府支持均对全国创新产出具有显著的正向影响,而交通运输具有显著的抑制作用;不同地区影响因素的作用存在差异。

Using location Gini coefficient, spatial autocorrelation and negative binomial panel regression methods, this paper explores the distribution characteristics and influencing factors of innovation output in the integrated circuit industry in 31 provinces, municipalities and autonomous regions in China from 2011 to 2019. The results show that: the agglomeration degree of innovation output in the whole country, the East and the Northeast is increasing, while that in the West and the Middle is decreasing;the innovation output in all regions of the country presents significant positive spatial agglomeration characteristics, and Moran’s I presents a "W" fluctuation;low-low agglomeration areas are mainly distributed in the west region, low-high agglomeration areas are mainly distributed in the central and eastern regions, high-high agglomeration areas are concentrated in the Yangtze River Delta, and high-low agglomerationereas are mainly located in Beijing and Guangdong;the economic foundation, industrial structure, scientific and technical personnel, education level and government support have significant positive impact on national innovation output, while transportation has significant inhibitory effect;the effects of influencing factors differentiate from region to region.