摘要
In the wire bonding process of microelectronic packaging,heat affect zone(HAZ)is an important factor governing the loop profile of bonding.The height of loop is affected by the length of the HAZ.Factors governing the HAZ were studied.To investigate this relationship,experiments were done for various sizes of wire and free air ball(FAB).Electric flame-off(EFO)current, EFO time,EFO gap and recrystallization were also studied.The results show that as the size of FAB becomes larger,the length of HAZ increases.With the increase of EFO current and time,the length of HAZ becomes longer.When FAB forms at the same parameter the length of HAZ becomes shorter with the high temperature of recrystallization.
作者
孙立宁
刘曰涛
刘延杰
SUN Li-ning;LIU Yue-tao;LIU Yan-jie(State Key Laboratory of Robotics and System,Harbin Institute of Technology,Harbin 150080,China;School of Mechanical Engineering,Shandong University of Technology,Zibo 255049,China)
基金
Project(50705027)supported by the National Natural Science Foundation of China
Project(2007AA04Z315)supported by the National High-Tech Research and Development Program of China。
