SVG子模块PCB壳体的电磁屏蔽效能仿真分析

Simulation Analysis of Electromagnetic Shielding Efficiency of SVG Submodule PCB Shell

静止无功发生器(Static Var Generator,SVG)产品的不断迭代升级,其子模块体积越做越小,使器件散热和电磁屏蔽成为分析的热点。根据相关统计和分析,工程现场SVG控制后台经常出现板卡故障,原因可能是板卡散热和电磁屏蔽相互制约。因此,解决子模块的散热和器件的干扰屏蔽成为研究的重点。基于现有SVG子模块内部的板卡舱即印制电路板(Printed Circuit Boar,PCB)壳体的散热开孔问题和电磁屏蔽问题,利用仿真软件ANSYS的HFSS分析功能,分别仿真了PCB壳体在材质分别为Q235(热镀锌板)和304(耐腐蚀不锈钢板)的封闭PCB壳体上,同样的位置开同等面积的带有圆形阵列孔、正六边形阵列孔和无开孔状态下的电磁屏蔽效能,给出了PCB壳体常用的开孔形状和不同材料对电磁屏蔽效能影响的情况。

With the continuous iteration and upgrading of SVG products,the volume of its sub-modules is getting smaller and smaller,and the resulting device heat dissipation and electromagnetic shielding have become a hot topic of analysis.According to the relevant statistics and analysis,SVG control background in the engineering site often reported board card failure,the cause may be the result of the mutual restriction of board card heat dissipation and electromagnetic shielding,so solving the heat dissipation of sub-modules and interference shielding of devices has become the focus of research.Based on existing Static Var Generator(SVG)modules within the board room is the cooling of the PCB(Printed Circuit Board)shell opening and electromagnetic shielding problems by using the simulation software HFSS analysis in ANSYS function,simulation PCB shell respectively in the material of Q235 respectively(hot galvanized sheet)and 304(corrosion resistance of stainless steel plate)on the PCB,closed shell,the same location on the same area of the circular array with a hole,hexagonal hole array and electromagnetic shielding effectiveness without opening condition,PCB shell commonly used hole shape is given and the effects on electromagnetic shielding effectiveness of different materials.