SnAgCu焊料蠕变行为试验及微电子功率模块热疲劳失效检测

Creep behavior test of SnAgCu solder and thermal fatigue failure detection of microelectronic power module

焊料良好的力学行为是微电子芯片高可靠性的重要保证。在交变温度载荷作用下,焊料层的蠕变特性往往直接决定电子芯片的使用寿命。因此开展焊料蠕变行为测试,了解电子芯片热疲劳失效机理是力学专业学生理解并应用力学理论解决工程实际问题的有效尝试。该文结合国家新旧能源转换背景,研发了一组芯片焊料蠕变测试与损伤检测平台,开展了SnAgCu焊料蠕变性能及微电子功率模块的热疲劳失效行为研究,为工科学生创造了良好的创新型实践条件。教学实践结果表明,此次实验有助于学生掌握材料蠕变行为的检测原理、过程以及在微电子芯片热疲劳评估中的应用,加深了学生对专业知识在工程实际应用的认识,提升了学生的学习兴趣。

Good mechanical behavior of solder is an important guarantee for high reliability of microelectronic chip.Under the alternating temperature load,the creep characteristics of solder layer often directly determine the service life of the chip.Therefore,it is an effective attempt for students majoring in engineering mechanics to understand mechanics theory and to solve practical engineering problems by applying the theory of mechanics according to the solder creep behavior test and thermal fatigue failure evaluation of microelectronic chips.Combined with the national background of new-old energy conversion,the experimental platform is developed for creep test of solder and damage detection of microelectronic chip in this paper,which creates good practice conditions for the students majoring in engineering.The results of teaching practice show that this experiment is helpful for students to master the detection principle and process of material creep behavior,as well as the application in the thermal fatigue assessment of microelectronic chips,deepen students’understanding of the practical application of professional knowledge in engineering,and enhance their interest in learning.