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银触点表面质量对开关温升的影响及控制要点

The Influence of the Surface State of the Silver Contact on the Temperature Rise of the Switch and the Control Points
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摘要 开关温升是决定开关性能的重要参数,直接影响到开关使用的可靠性和安全性。开关中银触点的接触电阻是影响温升的主要参数,影响银触点接触电阻的因素很多,其中银触点表面质量是较难控制的因素。本文从银触点表面质量入手,通过分析其对开关接触电阻和温升的影响,阐述其在开关中的重要性,同时提出在生产、包装和储运过程中对银触点的控制要点,以期为相关企业提供有益的参考。 The temperature rise of the switch is an important parameter that determines the performance of the switch,which directly affects the reliability and safety of the switch.The contact resistance of the silver contact in the switch is the main parameter that affects the temperature rise.There are many factors that affect the contact resistance of the silver contact,and the surface quality of the silver contact is a more difficult factor to control.In order to provide useful reference for related enterprises,this article starts with the surface quality of the silver contacts,analyzes its influence on the contact resistance and temperature rise of the switch,expounds its importance in the switch,and puts forward the control points of the silver contacts in the production,packaging,storage and transportation process.
作者 万海元
出处 《日用电器》 2021年第7期111-114,131,共5页 ELECTRICAL APPLIANCES
关键词 开关银触点 表面质量 接触电阻 温升 switch silver contacts surface quality contact resistance temperature rise
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二级参考文献6

  • 1Malucci R D.High Frequency Considerations for MultiPoint Contact Interfaces[J]. Proceeding of the Forty-Fifth IEEE Holm Conference on Electrical Contacts,2001.
  • 2Holm R.Electrical Contacts[M].New York:Springer, 1979.
  • 3Timoshenko S,Goodier J N.Theory of Elasticity[M]. New York:Mc-Graw Hi11,1951.
  • 4Greenwood J A. Constriction Resistance and the Real Area of Contact[J ]. Brit. J. Appl. Phys., 1966, 17:1621 - 1632.
  • 5Lionel Boyer. Contact Resistance Calculations: Generalizations of Greenwood's Formula Including Interface Films [J]. 1EEE Transactions on Components and Packing Technologies, 2001,24(1) : 50 - 59.
  • 6Nakamura M,Minowa I.Computer Simulation for the Conductance of a Contact Interface[J]. IEEE Transactions on Components, Hybrids and Manufacturing Technology, 1986,CHMT - 9: 150- 155.

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