冶金法制高纯硅过程中黏结剂对球团性能影响

Effect of Binder on Pellet Properties during Preparing High Purity Silicon by Metallurgical Method

分别以淀粉和水玻璃为黏结剂压制球团,通过对比试验测定球团的抗碎强度和电阻率,考察压制压力、焙烧温度、保温时间对球团物理性能的影响。结果表明,20 MPa压制压力下淀粉黏结剂生球团(A球团)的抗碎强度为70.2%,电阻率为20.4Ω·cm;15 MPa压制压力下水玻璃黏结剂生球团(B球团)的抗碎强度为72.6%,电阻率为15.6Ω·cm;焙烧温度升高,保温时间延长,球团抗碎强度和电阻率均逐渐减小。

Starch and sodium silicate were used as binder to press the pellets,and the shatter strength and resistivity of the pellets were measured by comparing experiments,the effects of the pressure,sintering temperature,holding time on the physical properties of pellets were investigated.The result showed that when the pressure was 20 MPa,the shatter strength of pellets A was 70.2%,the resistivity of pellets A was 20.4Ω·cm;when the pressure was 15 MPa,the shatter strength of pellets B was 72.6%,the resistivity of pellets B was 15.6Ω·cm,with a higher sintering temperature and longer holding time,the shatter strength and resistivity of the pellets decrease gradually.