摘要
在印制电路板制造行业中,产品要求愈来愈严格,在高厚径比产品逐渐起量的阶段,因工厂无脉冲电镀而造成生产困扰,因此通过将普遍的龙门式电镀线其中的个别铜槽进行改造成脉冲电镀槽,实现即可生产单向电镀又能生产脉冲电镀的混合式电镀线,选择脉冲电镀的原因皆是因为传统电镀无法满足高纵横比的贯孔率和精细蚀刻兼得的目的,因此通过将传统电镀槽改造成脉冲电镀槽,从实践中得到了一定的价值收益,借此与同行交流和分享。
In printed circuit board manufacturing industry,the product becomes more and more strict and the amounts of products of high aspect ratio is increasing.Due to lack of pulse electroplating,the factory production is bothered.So by converting individual copper slot of common gantry electroplating line into pulse plating bath,the factory can manufacture unidirectional plating and pulse plating composite electroplating.The reason for choosing pulse electroplating is that traditional electroplating cannot meet the goals of high penetration rate of aspect ratio and fine etching.Therefore,by transforming the traditional electroplating bath into pulse electroplating bath,some value gains have been obtained from practice.
作者
叶汉雄
邱成伟
谭才文
Ye Hanxiong;Qiu Chenwei;Tan Caiwen(Huizhou China Eagle Electronic Technology Co.,Ltd,Huizhou Guangdong,519029)
出处
《印制电路信息》
2021年第8期22-27,共6页
Printed Circuit Information
关键词
设备改造
脉冲电镀
高厚径比
贯孔率
Upgrading
Pulse Plating
High Aspect Ratio
The Penetration Rate of Hole